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| www..com Surface Mount Monolithic Integrated PIN Diode Chip: 0604 Unconnected Double Tee Features * No Wirebonds Required * Rugged Silicon-Glass Construction * Silicon Nitride Passivation & Polymer Scratch Protection * Ultra-Low Parasitic Capacitance and Inductance * Higher RF C.W. Power Handling * Better Performance than Alternative Packaged Devices MADP-064908-131000 Surmount TM PIN Chip V1 Absolute Maximum Ratings1 @ T A = +25 C (unless otherwise specified) Parameter Forward Current Reverse Voltage Operating Temperature Storage Temperature Absolute Maximum 250 mA l -100 V l -55 C to +125 C -55 C to +150 C +175 C +35 dBm +300 C for 10 seconds Description and Applications This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM's patented HMIC process. This 8.0 m I-region length device features 6 silicon pedestals embedded in a low loss, low dispersion glass. The diodes are formed on the top of a pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. The vertical Silicon Diode topology provides for a highly efficient heat transfer medium. These packageless devices are suitable for usage in Higher ( 3 W Avg ) Incident Power Switches. Small Parasitic Inductance and Excellent RC Constant make the devices ideal for Absorptive SPST, Reflective SP2T Switches, and Attenuator Circuits, where higher P1db and Power Handling values are required. Junction Temperature C.W. Incident Power (dBm) Mounting Temperature 1. Operation of this device above any one of these parameters may cause permanent damage. 0604 Case Style - ODS-1310 (Topview) 1 6 5 2 3 4 Side View D D D D D C Dim A B C D Inches Min. Max. 0.060 0.062 0.036 0.004 0.011 0.038 0.008 0.012 Millimeters Min. Max. 1.524 1.575 0.914 0.102 0.279 0.965 0.203 0.305 1 2 D 3 4 D D 6 5 Circuit Side 1. Backside Metal: 0.1microns thick. 2. Shaded Areas Indicate Backside Ohmic Gold Contacts. 1 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Surface Mount Monolithic Integrated PIN Diode Chip: 0604 Unconnected Double Tee Electrical Specifications @ +25 C, per Diode Junction Symbol Conditions Units Min. MADP-064908-131000 Surmount TM PIN Chip V1 Typ. Max. CT CT RS VF VR IR TL -40 V, 1 MHz1 -40 V, 1 GHz1,3 10 mA, 1 GHz2,3 10 mA -10 A -70 V + 10 mA / -6 mA 1A / 10 mA pF pF 0.05 0.04 5.0 0.83 l -70 l l -100 l l -0.1 l 200 150 0.07 0.06 V V A ns C / W 1.00 l -10 l TH 1. Total capacitance, CT, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar. 2. Series resistance RS is equivalent to the total diode resistance : Rs = Rj ( Junction Resistance) + Rc ( Ohmic Resistance) 3. Rs, CT, TL, TH are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package with Sn 60/Pb 40 Solder Equivalent 0604 Style Double Tee Equivalent Circuit 1 Top View 6 5 2 3 4 Notes: 1. Ports 2 and 5 have a Connected Cathode-Anode Node. 2. Ports 1,3,4, and 6 Have a Singular, Un-Connected Node. 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Surface Mount Monolithic Integrated PIN Diode Chip: 0604 Unconnected Double Tee Assembly Guidelines Handling MADP-064908-131000 Surmount TM PIN Chip V1 All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Bonding Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80 Au / 20 Sn or Sn 60 / Pb 40 solder is recommended. Conductive silver epoxy for die attachment, approximately 2 mils in uniform thickness may also be used for lower Incident power applications ( < 1 W Average Power ). When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and force of 60 to 100 grams applied normal to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. The solder joint must Not be made one at a time, creating un-equal heat flow and thermal stress. Solder reflow should Not be performed by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is completed. A typical profile for a Sn 60/ Pb 40 Soldering process is provided in Application Note, " M538 " , " Surface Mounting Instructions " on the MA-COM website www.macom.com 3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Surface Mount Monolithic Integrated PIN Diode Chip: 0604 Unconnected Double Tee MADP-064908-131000 Surmount TM PIN Chip V1 Circuit Applications : SP2T All Series Reflective Switch with +5V and TTL Logic Control ( 2- 18 GHz ) J1 ? +1.8 V 22 pF ? J22? pF 15 nH J2 22 pF 1 3,6 2 22 pF 15 nH HMIC Die 5 15 nH 4 22 pF J3 22 pF B2 Bias +5 V +5V +5V B3 Bias 100 100 +5V SN7406, SN7416 TTL Open Collector Gate Driver ( X2 ) 4 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Surface Mount Monolithic Integrated PIN Diode Chip: 0604 Unconnected Double Tee MADP-064908-131000 Surmount TM PIN Chip V1 RF Truth Table for Reflective SP2T using Singular Power Supply: + 5V, + I Only RF State B2 Diode Bias B3 Diode Bias J1 - J2 Low Loss & J1- J3 Isolation J1 - J3 Low Loss & J1-J2 Isolation + 3.6 V @ + 14 mA +0.5 V @ 0 mA +0.5 V @ 0 mA + 3.6 V @ + 14 mA Notes: 1. Diode Forward Voltage Differential ( Vf ) @ 15 mA = 0.9 V 2. Insertion Loss Diode Bias = ( + 5V - (2)* 0.9 V - 1.8 V ) / ( 100 ) = 14 mA 3. Off Isolation Diode Back Bias Voltage = | - ( +1.8 V - 0.5 V ) | = | - 1.3 V |. 5 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Surface Mount Monolithic Integrated PIN Diode Chip: 0604 Unconnected Double Tee MADP-064908-131000 Surmount TM PIN Chip V1 Circuit Applications : SPST All Series Absorptive Switch with +5V and TTL Logic Control ( 2- 18 GHz ) +5V 22 pF TTL DRIVER -5V J1 22 pF 15 nH B1 Bias J2 1 2 3,4 22 pF 15 nH HMIC Die 5 6 43 6 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Surface Mount Monolithic Integrated PIN Diode Chip: 0604 Unconnected Double Tee MADP-064908-131000 Surmount TM PIN Chip V1 RF Truth Table for Absorptive SPST using + 5V, - 5V Power Supplies RF State TTL Value B1 Diode Bias J1 - J2 Low Loss J1-J2 Isolation 0 1 - 1.8 V @ -20 mA + 2.7 V @ + 20 mA Notes: 1. Diode Forward Voltage Differential ( Vf ) @ 20 mA = 0.9 V 2. Diode Rs @ 20 mA = 3.5 3. Insertion Loss Diode Bias = ( - 1.8 V ) @ -20 mA from a Constant Current Source 4. Off Isolation Diode Back Bias Voltage through (2) Diodes = | - ( +2.7 V - 0 V ) | = | - 2.7 V |. 7 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Surface Mount Monolithic Integrated PIN Diode Chip: 0604 Unconnected Double Tee MADP-064908-131000 Surmount TM PIN Chip V1 Circuit Applications : SPST All Series Reflective Switch with +5V and TTL Logic Control ( 2- 18 GHz ) +5V SN7406, SN7416 Open Collector Gate Driver +5V 47 22 pF 1k 15 nH J1 15 nH B1 Bias J2 1 22 pF 2 3,4 HMIC Die 5 6 22 pF RF Truth Table for Reflective SPST using Singular Power Supply: + 5V, + I Only RF State TTL Value B1 Diode Bias J1 - J2 Low Loss J1-J2 Isolation 0 1 + 0.5 V @ +20 mA +5.0 V @ 0 mA 8 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. Surface Mount Monolithic Integrated PIN Diode Chip: 0604 Unconnected Double Tee MADP-064908 SPICE Model MADP-064908-131000 Surmount TM PIN Chip V1 Equivalent per Diode Schematic PinDiodeModel NLPINM1 Is=1.0E-14 A Vi=0.0 V Un=900 cm^2/V-sec Wi=7.5 um Rr=20 K Ohm Cmin=0.05 pF Tau=0.20 usec Rs=0.1 Ohm Cj0=0.06 pF Vj=0.7 V M=0.5 Fc=0.5 Imax=1.0E+6 A/m^2 Kf=0.0 Af=1.0 wBv=80 V wPmax=3.0 W Ffe=1.0 Ls Cp Rp Rvia Rvia _ Notes : Rs = 2 * Rvia + Rp + 9 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information. * North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information. |
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